Intel’s Upcoming Core i3, i5, i7 Lineups Unveiled.
As some of you probably already know, Intel is preparing the launch of its new mainstream processors, most of which are based on the company’s next-generation Lynnfield core. These new CPU models have been designed for the company’s LGA 1156 socket, meaning that motherboard makers will have their work cut out for them, trying to gain more market share with the new boards. On that note, it appears that we now have a more complete image of what is to come from the Santa Clara, California-based chip maker.
According to a recent news article that surfaced on the HKEPC website, the chip maker’s first wave of LGA 1156-compatible processors will include three models, the quad-core Core i5 750, the Core i7 860 and the Core i7 870. The Core i7 models are designed for high-end systems and boast speeds of 2.8GHz and 2.93GHz, respectively, as well as an integrated dual-channel DDR3-1333 memory controller, 8MB of L3 cache and a TDP of 95W. The Core i7 models features support for Hyper-Threading technology (consequently enabling support for multi-threaded applications), while the less powerful and less expensive Core i5 will be clocked at 2.66GHz and will have no Hyper-Threading feature.
Later on, in the first quarter of 2010, the company is said to be planning to launch the energy-efficient models (at 82W TDP) of the aforementioned Core i5 750 and Core i7 860, with prices said to start at US$259 and US$337, respectively.
As for the company’s 32nm lineup, Intel looks to announce the first 32nm LGA 1156-based processors in Q1 2010, making them available in six flavors, all of which will be dual-core processors with DirectX 10-integrated graphics processor, a DDR3-1333 memory controller and a TDP of 73W. The six will be part of both Core i3 and Core i5 series, with two models in the Core i3 family, three in the Core i5 series and one in the Pentium family.